Cleanroom

The cleanroom offers ample hood space, an optical microscope, internet access and (in the rightmost hood) a spin coater.
The cleanroom offers ample hood space, an optical microscope, internet access and (in the rightmost hood) a spin coater.
Lithographic resists can be spun onto samples using this spin coater.
Lithographic resists can be spun onto samples using this spin coater.
The rapid thermal annealer (RTA) is used to improve the semiconductor/metal interface in our devices.
The rapid thermal annealer (RTA) is used to improve the semiconductor/metal interface in our devices.
The oxygen plasma cleaner (left) and ozone stripper (right) are used to remove organics from samples
The oxygen plasma cleaner (left) and ozone stripper (right) are used to remove organics from samples
This BOC Edwards e-beam evaporator uses an electron beam to heat a metal source and deposit thin metal films.
This BOC Edwards e-beam evaporator uses an electron beam to heat a metal source and deposit thin metal films.
This BOC Edwards thermal evaporator uses resistive heating to volatilize a metal source and deposit thin metal films.
This BOC Edwards thermal evaporator uses resistive heating to volatilize a metal source and deposit thin metal films.
The AB-M mask aligner has mid-UV and deep-UV exposure capabilities. The minimum feature size achievable is about 1-2 microns.
The AB-M mask aligner has mid-UV and deep-UV exposure capabilities. The minimum feature size achievable is about 1-2 microns.