The cleanroom offers ample hood space, an optical microscope, internet access and (in the rightmost hood) a spin coater. Lithographic resists can be spun onto samples using this spin coater. The rapid thermal annealer (RTA) is used to improve the semiconductor/metal interface in our devices. The oxygen plasma cleaner (left) and ozone stripper (right) are used to remove organics from samples This BOC Edwards e-beam evaporator uses an electron beam to heat a metal source and deposit thin metal films. This BOC Edwards thermal evaporator uses resistive heating to volatilize a metal source and deposit thin metal films. The AB-M mask aligner has mid-UV and deep-UV exposure capabilities. The minimum feature size achievable is about 1-2 microns.
