Cleanroom

The cleanroom offers ample hood space, an optical microscope, internet access and (in the rightmost hood) a spin coater.

Lithographic resists can be spun onto samples using this spin coater.

The rapid thermal annealer (RTA) is used to improve the semiconductor/metal interface in our devices.

The oxygen plasma cleaner (left) and ozone stripper (right) are used to remove organics from samples.

This BOC Edwards e-beam evaporator uses an electron beam to heat a metal source and deposit thin metal films.

This BOC Edwards thermal evaporator uses resistive heating to volatilize a metal source and deposit thin metal films.

The AB-M mask aligner has mid-UV and deep-UV exposure capabilities. The minimum feature size achievable is about 1-2 microns.