INSTRUMENT | REMARKS | LOCATION |
---|---|---|
Langmuir-Blodgett trough | Wafer scale alignment & transfer of nanostructures | Characterization-1 |
Electron-beam evaporator | Source metals: Ti, Ni, Pd, SiO2 | Characterization-4 |
Wire bonder | Chip fabrication | Characterization-1 |
UV & ozone dry stripper | Cleanroom | |
Rapid thermal annealer (RTA) | Available process gases: Forming gas (N2/H2), Ar, N2, O2 | Cleanroom |
Plasma cleaner | Cleanroom | |
Optical microscope | Bright field and dark field; 5x, 20x and 50x objectives | Cleanroom |
Electron-beam lithography platform | Writes with a minimum feature size of ~100 nm in standard e-beam resists on a range of substrates | Characterization-1 |
Sonicator | Cleanroom | |
Spin coater | Cleanroom | |
Spin coater | Located in laminar flow hood for spinning high quality e-beam resist | Wetlab |
Water purifier (2x) | Cleanroom, Wetlab |