| INSTRUMENT | REMARKS | LOCATION |
|---|---|---|
| Langmuir-Blodgett trough | Wafer scale alignment & transfer of nanostructures | Characterization-1 |
| Electron-beam evaporator | Source metals: Ti, Ni, Pd, SiO2 | Characterization-4 |
| Wire bonder | Chip fabrication | Characterization-1 |
| UV & ozone dry stripper | Cleanroom | |
| Rapid thermal annealer (RTA) | Available process gases: Forming gas (N2/H2), Ar, N2, O2 | Cleanroom |
| Plasma cleaner | Cleanroom | |
| Optical microscope | Bright field and dark field; 5x, 20x and 50x objectives | Cleanroom |
| Electron-beam lithography platform | Writes with a minimum feature size of ~100 nm in standard e-beam resists on a range of substrates | Characterization-1 |
| Sonicator | Cleanroom | |
| Spin coater | Cleanroom | |
| Spin coater | Located in laminar flow hood for spinning high quality e-beam resist | Wetlab |
| Water purifier (2x) | Cleanroom, Wetlab |