| INSTRUMENT |
REMARKS |
LOCATION |
| Langmuir-Blodgett trough |
Wafer scale alignment & transfer of nanostructures |
Characterization-1 |
|
| Electron-beam evaporator |
Source metals: Ti, Ni, Pd, SiO2 |
Characterization-4 |
|
| Wire bonder |
Chip fabrication |
Characterization-1 |
|
| UV & ozone dry stripper |
|
Cleanroom |
|
| Rapid thermal annealer (RTA) |
Available process gases:
Forming gas (N2/H2), Ar, N2, O2 |
Cleanroom |
|
| Plasma cleaner |
|
Cleanroom |
|
| Optical microscope |
Bright field and dark field; 5x, 20x and 50x objectives |
Cleanroom |
|
| Electron-beam lithography platform |
Writes with a minimum feature size of ~100 nm in standard e-beam resists on a range of substrates |
Characterization-1 |
|
| Sonicator |
|
Cleanroom |
|
| Spin coater |
|
Cleanroom |
|
| Spin coater |
Located in laminar flow hood for spinning high quality e-beam resist |
Wetlab |
|
| Water purifier (2x) |
|
Cleanroom, Wetlab |
